Avoiding Voids
An All-Encompassing Solution.
Along with the
very convincing
of Convergence-Pad
Soldering, this also
effects another finish
inside a connection.
View of the inner structure using the common process including an abrupt removal of the heat-source.
View of the inner structure after well performed Heat-Lifting via Convergence Solder Pad.
Shrinkage
Direction
In Conjunction With Heat Dissipation
Beyond the observation
of volume dilatation itself,
we now consider a definite
direction of the shrinkage
since there are directed
and dominant ways
respective heat dissipation.
There is a convergent cooling of the solder on the left hand, appropriate to a directed heat dissipation via adjacent conductive paths.
The shrinkage increases on the opposite side, where the high heat saturation of the pin also becomes apparent, causing a disorderly cooling and the rough and granular texture on the right hand.
Granulation
Hard To Retrace
With highly resolving
and detailed sequences,
we redefine causation of
granulated solder joints,
by convention and spuriously,
being traced back
to solder composition.
Observing the cooling-process, a granulation occurs, where the solder cools down disordered and abruptly, with no definite direction.
Sn95.8Ag3.5Cu0.7
Sn95.5Ag3.8Cu0.7
Sn96.5Ag3.0Cu0.5
Subsidence
Also Based On Thermodynamic Impacts
The very high replicability
of a certain defect is
opposed to prevalent
attempts to explain,
mainly based on outgassing
and sudden flux evaporation.
A subsidence occurs, where more than two opposite cooling- and shrinkage directions collide.
The heat dissipation via the pin finally potentiates the number of shrinkage directions.
Sn63Pb37
Alloy
Test Bench
Primacy To One Principle
Considering the new
while using our subject,
operations throughout
open out into convincing
success and quality
regardless an arbitrary
range of solder alloys.
Sn96.5Ag3.0Cu0.5
Sn63Pb37
Sn95.8Ag3.5Cu0.7
Sn99.3Cu0.7
Sn95.5Ag3.8Cu0.7
Results Comparative
Repeatability
On The Test Bench: The State Of The Art
Demonstrating the
repeatability of soldering-
defects and results,
depending on design and
associated heat dissipation.
Comparing two different designs, the results show congruent
appearances, with a high degree of regularity in the solder
structure in the area of directed heat dissipation(red arrrows).
Heat dissipation opposite
to 90 degree angle.
Heat dissipation opposite
to 180 degree angle.
Neuer Text