On the basis of construction trade L. Skoda converted the causation of shrinkage cracks to also explain the disturbances within solder joints.
The unequal heat dissipation of a solder joint appears analogous to premature evaporation of water (-> volume shrinkage) causing anomalies within the material.
Handling the very high requirements for aviation- and space electronics and multiple certified, Skoda published empirical studies and developed a novel system and soldering technique.
With the Convergence Pad as a PCB Layout-conception, Skoda himself registered for a patent and provides a highly efficient and innovative solution for any production appliance.
Furthermore, the working principle therein opens up new approaches to process engineering for reflow and wave soldering processes.
" I'm always interested in challenges and to bring progressive acquirements to your enterprise." (L.Skoda)
ECSS-Q-ST-70-08C – Manual soldering of high-reliability electrical connections
ECSS-Q-ST-70-38C – High-reliability soldering for surface-mount and mixed technology
ECSS-Q-ST-70-28C – Repair and modification of printed circuit board assemblies for space use